This chapter is from the book
This chapter is from the book
This chapter is from the book
1.3 Summary
- Microwave integrated circuits can be classified according to the fabrication method of the patterned substrate and in terms of monolithic and hybrid integration. Hybrid integration can be further classified into integrations based on PCB, thick film, and thin film. In the selection of integration, one type cannot be said to be superior to the other; the choice is made depending on the application and given situation, and by taking into consideration several factors such as cost, time, pattern accuracy, and assembly.
- Among active microwave circuits, the most commonly used building blocks for wireless communication systems or other systems, such as repeaters, transponders, and radars, are amplifiers, oscillators, and mixers.
References
- T. S. Lavergetta, Microwave Materials and Fabrication Techniques, Dedham, MA: Artech House, Inc., 1984.
- K. C. Gupta, Microstrip Lines and Slot Lines, 2nd ed. Dedham, MA: Artech House, Inc., 1996.
Problems
1.1 A waveguide generally has lower line loss than a microstrip. An SIW (substrate integrated waveguide) can be considered as the planar version of a waveguide. How is an SIW configured using a substrate?
1.2 Find the TR (transmission and receiving) module example built using a LTCC on the Web site www.barryind.com.
1.3 How is the ALC in Figure 1.7 constructed?
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1.4 Refer to the FM demodulator IC SA605, which is used to demodulate an FM signal. Explain how the FM signal is demodulated using its block diagram.
1.5 Refer to the Web site of vendors of PLL IC such as Analog Devices Inc. or other companies. Explain the synthesizer data bus shown in Figure 1.7.
1.6 How can the PLL be modulated? Explain how to set the PLL loop bandwidth by taking the bandwidth of a bandlimited modulation signal into consideration.